Patterning process and undercoat-forming material

Details Patterning process and undercoat-forming material Patterning process and undercoat-forming material

2004-06-22

2008-09-23

Kelly, Cynthia H. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S311000

Reexamination Certificate

active

07427464

ABSTRACT:
A pattern is formed by applying an undercoat layer comprising a naphthol-dicyclopentadiene copolycondensate on a processable substrate as an antireflective film, applying a photoresist layer over the undercoat layer, exposing the photoresist layer to radiation, developing the resist with a developer to form a resist pattern, and dry etching the undercoat layer and the substrate through the photoresist layer as a mask. The undercoat layer has an optimum refractive index to provide a satisfactory antireflection effect at a film thickness of 200 nm or greater as well as high etching resistance. The shape of resist after patterning remains satisfactory.

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