Patterning process

Details Patterning process Patterning process

2011-01-04

2011-01-04

Duda, Kathleen (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S394000

Reexamination Certificate

active

07862986

ABSTRACT:
The invention is directed to a method for patterning a material layer. The method comprises steps of forming a mask layer on the material layer. A multiple patterning process is performed on the mask layer for transferring at least a first pattern from a first photomask through a first photoresist and a second pattern from a second photomask from a second photoresist layer into the mask layer without performing any etching process. The mask layer exposes a portion of the material layer and the mask layer is patterned at the time that the first photoresist layer and the second photoresist layer are developed respectively. An etching process is performed to pattern the material layer by using the mask layer as an etching mask.

REFERENCES:
patent: 5686223 (1997-11-01), Cleeves
patent: 6943124 (2005-09-01), Lu et al.
patent: 2003/0216026 (2003-11-01), Mukherjee-Roy et al.
patent: 2005/0148170 (2005-07-01), Bhave et al.
patent: 2006/0216649 (2006-09-01), Paxton et al.
patent: 2004-054286 (2004-02-01), None
patent: I224363 (2004-11-01), None

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