Patterning method

Details Patterning method Patterning method

2006-10-03

2006-10-03

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S500000, C347S106000, C427S098500, C257SE21114

Reexamination Certificate

active

07115507

ABSTRACT:
A substrate is patterned by forming an indent region8in the surface10of a substrate4and depositing a liquid material onto the surface10at selected locations adjacent to the indent region8. The liquid material spreads over the surface to an edge of the indent region, at which point further spreading is controlled by the effective enhancement of the contact angle of the liquid material relative to the surface as provided by the indent region.

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patent: WO 02/073712 (2002-09-01), None

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