Patterning a surface comprising silicon and carbon

Details Patterning a surface comprising silicon and carbon Patterning a surface comprising silicon and carbon

2007-07-19

2010-12-14

Walke, Amanda C. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S270100, C430S311000, C430S331000, C430S314000, C430S322000

Reexamination Certificate

active

07851138

ABSTRACT:
Patterning a surface, comprising at least one feature having silicon coupled to a substrate, is described herein. In one embodiment a method is described for patterning a surface which comprises at least one feature having silicon and at least one feature having carbon coupled to a substrate. The surface is coated with 3-(trimethoxysilyl)propyl methacrylate, and a photoresist is applied the 3-(trimethoxysilyl)propyl methacrylate coated surface. The photoresist is imaged and the surface is etched. The photoresist is then removed.

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