Patterned strained silicon for high performance circuits

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer

Reexamination Certificate

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Details

C438S164000, C438S960000, C117S090000

Reexamination Certificate

active

06878611

ABSTRACT:
In the preferred embodiment of this invention a method is described to convert patterned SOI regions into patterned SGOI (silicon-germanium on oxide) by the SiGe/SOI thermal mixing process to further enhance performance of the logic circuit in an embedded DRAM. The SGOI region acts as a template for subsequent Si growth such that the Si is strained, and electron and holes in the Si have higher mobility.

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