Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
Reexamination Certificate
2006-05-09
2006-05-09
Norton, Nadine G. (Department: 1765)
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
C216S042000, C216S044000, C216S089000
Reexamination Certificate
active
07041229
ABSTRACT:
To provide a manufacturing method for simultaneously forming machined patterns different in dept in a small number of steps and a machined pattern having a U-shaped sectional form in which depths and widths are smoothly changed. Mask patterns62respectively having a semicircular sectional form and mask patterns65respectively having a V-shaped sectional form are formed at different opening widths63and64respectively to perform sandblasting by using the mask patterns62and65as masks. Though a deep groove is formed between the semicircular-sectional-form mask patterns62,a shallow groove is formed between the V-shaped-sectional-form mask patterns65.
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Drinker Biddle & Reath LLP
Norton Nadine G.
Pioneer Corporation
Tran Binh X.
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