Patterned multi-layer structure and manufacturing method

Details Patterned multi-layer structure and manufacturing method Patterned multi-layer structure and manufacturing method

1978-04-27

1982-02-02

Gantz, Delbert E.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192EC, 204192E, 313371, 428696, 428701, 427165, G02B 528

Patent

active

043136486

ABSTRACT:
A patterned multi-layer structure for a stripe filter used for a photoelectric pickup tube, comprises a protective layer preventing a substrate from being etched by reactive sputter etching and a multi-layer optical filter formed on the protective layer patterned by reactive sputter etching into a stripe pattern.
The etching rate of the protective layer by an etching gas agent is not greater than that of the multi-layer filter.

REFERENCES:
patent: 3743586 (1973-07-01), Vossen
patent: 3914464 (1975-10-01), Thomasson et al.
patent: 4004176 (1977-01-01), Otake et al.
patent: 4029394 (1977-06-01), Araki
patent: 4030967 (1977-06-01), Ingrey et al.
H. Komiya et al., The Application of Gas Plasma . . . , IEDM Technical Digest, 1973, pp. 459-462.
John Vossen and Werner Kern, Thin Film Processes, Academic Press, New York, pp. 497-498, 526-527, 535-543.
J. R. Gardiner et al., Al.sub.2 O.sub.3 Protection of SI.sub.3 N.sub.4 During RF Sputter Etching, IBM Technical Disclosure Bulletin, vol. 13, No. 12, pp. 3657.

Affiliated with

Also associated with

Rating

Patterned multi-layer structure and manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Patterned multi-layer structure and manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Patterned multi-layer structure and manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1819030