Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-04-04
2006-04-04
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S466000, C438S780000, C438S782000, C438S951000
Reexamination Certificate
active
07022541
ABSTRACT:
A wafer-scale fabrication approach for manufacturing single-walled carbon nanotube (SWNT) tips is implemented. Catalyst material is selectively placed (e.g., patterned) onto a plurality of prefabricated elevated structures (e.g., silicon tips) on a wafer. SWNTs are grown protruding from the catalyst on the elevated structures. The resulting SWNT protruding from a tip can be implemented in a variety of applications, such as in atomic force microscopy (AFM). With this approach, nanotube tips can be implemented for a variety of applications, including advanced nanoscale imaging, imaging of solid-state and soft biological systems and for scanning probe lithography.
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Dai Hongjie
Yenilmez Erhan
Booth Richard A.
Crawford & Maunu PLLC
The Board of Trustees of the Leland Stanford Junior University
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