Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2006-08-04
2009-06-30
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S765000, C977S857000
Reexamination Certificate
active
07553776
ABSTRACT:
The present invention provides a method for preparing a silicon substrate and a silicon substrate having a silicon surface comprising a pattern of covalently bound monolayers. Each of the monolayers comprises an alkyne, wherein at least a portion of each monolayer is no more than about 5 molecules of the alkyne wide.
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Buriak Jillian M.
Hurley Patrick T.
Barnes & Thornburg LLP
Ghyka Alexander G
Patel Reema
Purdue Research Foundation
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