Pattern transistor mask and method of using the same

X-ray or gamma ray systems or devices – Specific application – Lithography

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378 34, 378205, 378206, 2504911, 25049224, 350164, 350166, 356401, G21K 500

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active

049641468

ABSTRACT:
Alignment in X-ray lithography is generally effected in such a manner that the surface of a target mark for alignment formed on a wafer is illuminated with light for alignment through an X-ray mask, and the position of the wafer is detected from the reflected light. On the basis of the finding that the reflected light from the mask, particularly from an absorber formed thereon, greatly degrades the precision and reliability in measurement, the present invention provides a pattern transfer mask provided with a thin film which lowers the reflection factor of the mask the thin film having a thickness set a .lambda./4n (.lambda.:the wavelength of the light for alignment; n: an integer) or an odd-number multiple thereof. Thus, it is advantageously possible to overcome the above-described lowering of precision and reliablity.

REFERENCES:
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patent: 3758326 (1973-09-01), Hennings et al.
patent: 3892973 (1975-07-01), Coquin et al.
patent: 4022927 (1977-05-01), Pfeiffer et al.
patent: 4293624 (1981-10-01), Buckley
patent: 4306006 (1981-12-01), Descamps et al.
patent: 4472824 (1984-09-01), Buckley
patent: 4587184 (1986-05-01), Schneider-Gmelch et al.
patent: 4647517 (1987-03-01), Hersener et al.
"High Transmission X-Ray Masks for Lithographic Applications", by Bassons et al., Solid State Tech., 9/1976, 378/35.
"Mask to Wafer Alignment System", by Feder et al., IBM Technical Disclosure Bulletin, vol. 16 #4, 9/1973, p. 1307, 378/34.
"Method for Aligning Circuits on Substrates", by Angilello IBM Technical Disclosure Bulletin, vol. 22 #6, 11/1979, 378/34.
"Mask to Wafer Alignment System", by Feder et al., IBM Technical Disclosure Bulletin, vol. 16 #4, 9/1973, p. 1306, 378/34.

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