Pattern-transfer process for forming...

Etching a substrate: processes – Etching of semiconductor material to produce an article...

Reexamination Certificate

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C216S024000, C216S041000, C216S079000, C385S016000

Reexamination Certificate

active

06905614

ABSTRACT:
Described is a photolithography “pattern transfer” process for forming Micro-Electro-Mechanical Systems (MEMS) structures. A first material layer is patterned so that raised portions of the layer define features of a MEMS structure to be formed. The resulting pattern is then “transferred” to the surface of a second material layer by etching the top surface of the first material layer, including the raised portions and the valleys defined between the raised portions, until the second layer is exposed between the raised portions.

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