Pattern printing method and apparatus

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

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Details

G01B 1100

Patent

active

047984708

ABSTRACT:
A pattern printing method includes a step of printing a pattern on a wafer on the basis of a target mark provided on the surface of the wafer which is opposite to the surface thereof on which the pattern is to be printed. Also disclosed is a pattern printing apparatus which comprises detecting means for detecting a target mark provided on the surface of a wafer which is opposite to the surface thereof on which a pattern is to be printed, and pattern printing means for printing the pattern on the pattern printing surface of the wafer on the basis of mark position data obtained by the detecting means.

REFERENCES:
patent: 4326805 (1982-03-01), Feldman et al.
patent: 4614433 (1986-09-01), Feldman et al.

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