Pattern inspection system for inspecting defect of land pattern

Details Pattern inspection system for inspecting defect of land pattern Pattern inspection system for inspecting defect of land pattern

1991-09-10

1993-05-25

Mancuso, Joseph

Image analysis

Histogram processing

For setting a threshold

358101, 358106, 382 49, G06K 900

Patent

active

052147126

ABSTRACT:
A pattern inspection system for inspecting a pattern of a land for a through-hole formed in a printed board. In the system there are included a first illumination device for optically illuminating the printed board, a second illumination device for illuminating the printed board with light modulated at a predetermined period and an image pickup responsive to reflection light and transmission light from the printed board due to the first and second illumination devices to photoelectrically convert the printed board into a gray level image. The gray level image is converted into a bi-level image by a bi-level conversion device and then converted into an edge image by an edge detecting device. The edge image is expanded and contracted by predetermined amounts so as to obtain a through-hole image corresponding to the through-hole. A defect detecting device detects a defect of the pattern of the printed board on the basis of the through-hole image and the bi-level image from the bi-level conversion device.

REFERENCES:
patent: 4477926 (1984-10-01), Linger et al.
patent: 4481664 (1984-11-01), Linger et al.
patent: 4665554 (1987-05-01), Sternberg
patent: 4893346 (1990-01-01), Bishop
patent: 4922308 (1990-05-01), Noguchi et al.
patent: 4975971 (1990-12-01), Ohnishi
patent: 5027417 (1991-06-01), Kitakado et al.
patent: 5046113 (1991-09-01), Hoki
"Machine-vision techniques for inspection of printed wiring boards and thickfilm circuits" by Jorge L. C. Sanz and Anil K. Jain; J. Opt. Soc. Am. A, vol. 3, No. 9; pp. 1465-1482, Sep. 1986.

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