Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2008-09-02
2008-09-02
Chawan, Sheela (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S218000, C356S394000, C356S237400, C348S130000
Reexamination Certificate
active
10642760
ABSTRACT:
A pattern inspecting method, comprising preparing a sample having a first and a second inspection regions and an imaging device having a plurality of pixels, scanning the first inspection region to a first direction using the imaging device to obtain a first measurement pattern representing at least parts of the first inspection region, scanning the second inspection region to the first direction using the imaging device to obtain a second measurement pattern representing at least parts of the second inspection region, comparing the first measurement pattern and the second measurement pattern with each other to determine presence or absence of a defect formed on the sample, and controlling a scanning condition for scanning a pattern of the second inspection region by the imaging device so as to keep the same with the scanning condition when the pattern of the first inspection region is scanned by the imaging device.
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Isomura Ikunao
Sanada Yasushi
Tojo Toru
Tsuchiya Hideo
Watanabe Toshiyuki
Chawan Sheela
Kabushiki Kaisha Toshiba
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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