Pattern-forming process using photosensitive resin composition

Details Pattern-forming process using photosensitive resin composition Pattern-forming process using photosensitive resin composition

2006-12-26

2006-12-26

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S288100, C430S906000

Reexamination Certificate

active

07153631

ABSTRACT:
There are disclosed a photosensitive resin composition which comprises(A) a polyamic acid having recurring units represented by the formula (I): wherein R1representsand R2represents a divalent organic group, and(B) an acryl compound having an amino group,and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.

REFERENCES:
patent: 4243743 (1981-01-01), Hiramoto et al.
patent: 4451551 (1984-05-01), Kataoka et al.
patent: 4548891 (1985-10-01), Riediker et al.
patent: 4565767 (1986-01-01), Kataoka et al.
patent: 4587197 (1986-05-01), Kojima et al.
patent: 4608333 (1986-08-01), Ohbayashi et al.
patent: 4783391 (1988-11-01), Ohbayashi et al.
patent: 5106720 (1992-04-01), Mueller et al.
patent: 5122436 (1992-06-01), Tunney et al.
patent: 5238784 (1993-08-01), Tokoh et al.
patent: 5399460 (1995-03-01), Aldrich et al.
patent: 5399655 (1995-03-01), Simmons, III
patent: 5472823 (1995-12-01), Hagiwara et al.
patent: 5474876 (1995-12-01), Haehnle et al.
patent: 5811218 (1998-09-01), Kaji et al.
patent: 5856059 (1999-01-01), Hagiwara et al.
patent: 6194126 (2001-02-01), Hagiwara et al.
patent: 418870 (1991-03-01), None
patent: 0580108 (1994-01-01), None
patent: 624826 (1994-11-01), None
patent: 718696 (1996-06-01), None
patent: 3-36861 (1991-06-01), None
The Society of Polymer Science, Japan, Polymer Preprints, Japan. vol. 41, No. 1 (1992).
The Society of Polymer Science, Japan, Polymer Preprints, Japan. vol. 42, No. 7 (1993).
The Society of Polymer Science, Japan, Polymer Preprints, Japan. vol. 42, No. 2 (1993).

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