Pattern forming process and process for preparing semiconductor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156643, 156656, 156657, 156662, 1566591, 156345, H01L 21306, B44C 122, C23F 100

Patent

active

053445228

ABSTRACT:
A process for forming an etching pattern, which includes selectively irradiating a light to a clean surface of a material to be worked by etching so as to form radicals from a photoradical forming substance in an atmosphere of the substance, forming a modified portion having an etching resistance at a photo-irradiated portion of the surface, and then subjecting an unmodified portion of the surface of the material to be worked to an etching treatment, thereby forming an etching pattern corresponding to a pattern formed by the irradiation.

REFERENCES:
patent: 3326717 (1967-06-01), Gregor et al.
patent: 3346384 (1967-10-01), Gaynor
patent: 4698238 (1987-10-01), Hayasaka et al.
patent: 4761199 (1988-08-01), Sato
patent: 4960675 (1990-10-01), Tsuo et al.
patent: 5024716 (1991-06-01), Sato
patent: 5024724 (1991-06-01), Hirono et al.
Sesselmann, et al., "Chlorine Surface Interaction and Laser-Induced Surface Etching Reactions," J. Vac. Sci. Tech. B3(5), Sep. 1985, pp. 1507-1512.
Taneya, et al., "Photo-Oxidation of GaAs For In Situ Patterned-Mask Formation Prior to Chlorine Gas Etching," Appl. Phys. Lett., vol. 56, No. 1, Jan. 1990, pp. 98-100.
Judge, et al., "Antireflective Chrome Photomasks," IBM Technical Disclosure Bulletin, vol. 13, No. 3, Aug. 1970.
Stetson, "Producing Reduced Reflectivity Master Mask on Working Plate," IBM Technical Disclosure Bulletin, vol. 18, No. 10, Mar. 1976.
Oehrlein, et al., "Plasma-Deposited Fluorocarbon Films on Silicon Studied By Ellipsometry," 2194 Thin Solid Films, vol. 143, No. 3, Oct. 1986, pp. 269-278.
Patent Abstracts of Japan, Kokai No. 62-217245, vol. 12, No. 79, Mar. 1988.
Patent Abstracts of Japan, Kokai No. 63-204259, vol. 12, No. 492, Dec. 1988.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pattern forming process and process for preparing semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pattern forming process and process for preparing semiconductor , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pattern forming process and process for preparing semiconductor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1327328

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.