Pattern forming method with selective silylation utilizing litho

Details Pattern forming method with selective silylation utilizing litho Pattern forming method with selective silylation utilizing litho

1995-12-15

1997-02-04

Young, Christopher G.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430324, 430326, 430323, G03F 730, G03F 740

Patent

active

055996531

ABSTRACT:
An improvement is proposed in a double-coated patterning plate, which consists of a substrate, an undercoat levelling layer and a photoresist layer thereon, as well as in the patterning method therewith. Different from conventional double-coated patterning plate in which the undercoat levelling layer is formed from poly(methyl methacrylate) resin, the layer in the invention is formed from a copolymeric resin of methyl methacrylate and glycidyl methacrylate in a specified copolymerization ratio and the resin is admixed with 2,2',4,4'-tetrahydroxybenzophenone. By virtue of the use of this unique resin composition for the undercoat levelling layer, the troubles due to intermixing between the undercoat levelling layer and the photoresist layer thereon can be avoided to impart the patterned resist layer with excellent properties.

REFERENCES:
patent: 5130223 (1992-07-01), Nishimura et al.
patent: 5158857 (1992-10-01), Shinozaki et al.
patent: 5498514 (1996-03-01), Nakao et al.

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