Pattern forming method and pattern forming apparatus

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface

Reexamination Certificate

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C264S326000, C425S375000

Reexamination Certificate

active

07862761

ABSTRACT:
A pattern forming method for forming a pattern on a pattern forming material on a substrate by using an imprint pattern provided to a mold is constituted by preparing a substrate having thereon a pattern forming area, disposing the pattern forming material placed in an uncured state in the pattern forming area in a dispersion state at a plurality of positions at different intervals, and curing the pattern forming material in a state in which the pattern forming material is deformed in a shape corresponding to a shape of the imprint pattern provided to the mold.

REFERENCES:
patent: 2004/0008334 (2004-01-01), Sreenivasan et al.
patent: 2004/0017077 (2004-01-01), Vyse et al.
patent: 2006/0036051 (2006-02-01), Xu et al.
patent: 2005120834 (2005-12-01), None
M. Colburn et al., “Step and Flash Imprint Lithography: A New Approach to High-Resolution Patterning,” Processings of the SPIE's 24th International Symposium on Microlithography: Emerging Lithographic Technologies III, Santa Clara, CA, vol. 3676, Part One, pp. 379-389 (Mar. 1999).
Stephan Y. Chou et al., “Imprint of Sub-25 nm Vias and Trenches in Polymers,” 67(21) Appl. Phys. Lett., 3114-16 (1995).
Ki-don Kim et al., “Minimization of Residual Layer Thickness by Using Optimized Dispensing Method in S-FIL Process,” Digest of Papers of The 4th International Conference on Nanoimprint and Nanoimprint Technology, 20P-5-39, pp. 106-107 (Oct. 2005).
Ki-don Kim et al., “Minimization of Residual Layer Thickness by Using the Optimized Dispensing Method in S-FIL Process,” 83 Microelectronic Engineering 847-50 (2006).
European Search Report and Search Opinion in Application No. EP 07109107 (Nov. 27, 2007).

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