Pattern forming method and method of manufacturing...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C430S961000

Reexamination Certificate

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07662543

ABSTRACT:
A pattern forming method includes forming a resist film on a substrate, coating the resist film with a coating solution which forms a cover film on the resist film to form the cover film on the resist film, transferring a pattern onto the resist film by an immersion lithography method using a liquid immersion fluid to form a latent image on the resist film, removing the cover film after the formation of the latent image, conducting a first inspection to inspect whether or not the cover film has a defect between said forming the latent image and said removing the cover film, performing predetermined processing when the defect is found in the first inspection, and developing the resist film to form a resist pattern on the substrate after said removing the cover film.

REFERENCES:
patent: 2005/0030511 (2005-02-01), Auer-Jongepier et al.
patent: WO-99/49504 (1999-09-01), None
Kawamura et al.; “Influence of the Watermark in Immersion Lithography Process”; Advances in Resist Technology and Processing XXII, Proceedings of SPIE, vol. 5753, pp. 818-826, (2005).

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