Pattern forming method

Details Pattern forming method Pattern forming method

1996-02-06

1998-08-11

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Processing feature prior to imaging

430311, 430394, 430396, G03F 720, G03F 7207

Patent

active

057925968

ABSTRACT:
In a method of forming a pattern, a photo-mask including a desired pattern is provided. A photo-sensitive resin film is spin-coated on a semiconductor substrate. Subsequently, the surface of the photo-sensitive resin film is changed to have a resistivity against a development solution. Next, light is illuminated to transmit the photo-mask. As a result, the resistivity of only the surface portion of the photo-sensitive resin film corresponding to the desired pattern is decreased based on the property of photo-sensitive resin film by the light having transmitted the photo-mask. Last, the photo-sensitive layer is developed with the development solution.

REFERENCES:
patent: 5476736 (1995-12-01), Tanabe
patent: 5525192 (1996-06-01), Lee
patent: 5554489 (1996-09-01), Ishibashi

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