Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1990-03-14
1992-06-02
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430280, 430921, 430326, 522 46, 522 59, G03C 173, G03F 738, G03F 739
Patent
active
051185822
ABSTRACT:
A pattern can be formed on a substrated using a pattern forming material comprising (a) a medium, e.g. a polymer or compound, having reactivity for changing solubility in an alkali aqueous solution by a reaction using an acid as a catalyst, and (b) as an acid precursor an alkylsulfonic acid ester obtained from a compound having at least two phenolic hydroxyl groups.
REFERENCES:
patent: 3779778 (1973-12-01), Smith et al.
patent: 3782939 (1974-03-01), Bonham
patent: 3852771 (1974-12-01), Ross et al.
patent: 4464458 (1984-08-01), Chow et al.
patent: 4755541 (1988-07-01), LiBassi et al.
patent: 4857435 (1989-08-01), Hopf et al.
patent: 4871645 (1989-10-01), Uenishi et al.
patent: 5015554 (1991-05-01), Ruckert et al.
patent: 5023164 (1991-06-01), Brunsvold et al.
Fukuma Emiko
Hayashi Nobuaki
Shiraishi Hiroshi
Tadano Keiko
Ueno Takumi
Hitachi , Ltd.
Hitachi Chemical Company Ltd.
McCamish Marion E.
Rodee Christopher D.
LandOfFree
Pattern forming material and process for forming pattern using t does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Pattern forming material and process for forming pattern using t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pattern forming material and process for forming pattern using t will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2227694