Pattern-forming material and its production and use

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430270, 430325, 430296, 430312, 430313, 430327, 430271, 430287, 156643, 528 10, G03C 171, C08G 7700

Patent

active

048638331

ABSTRACT:
A high-energy radiation-sensitive pattern-forming resist material consisting of polysilsesquioxane having no hydroxyl group in its molecule. The pattern-forming material of this invention has an improved sensitivity to high-energy radiation exposure, a high resistance to dry etching, a high resolution capability, and an improved thermal stability.

REFERENCES:
patent: 4600685 (1986-07-01), Kitakohji et al.
International Polymer Science and Technology, vol. 8, No. 9, 1981, pp. T51-T53, Shawbury, Shrewsbury, GB; T. V. Vasil Eva et al.: "Influence of the Conditions of Continuous Hydrolysis of Methyltrichlorosilane on the Composition of the Reaction Products", p. T51, col. 2, lines 2-15; p. T52, formulas.
Patents Abstracts of Japan, vol. 6, No. 245 (P-159) [1123], 3rd Dec. 1982; & JP-A-57 141 642 (Fujitsu K.K.) 02-09-1982.
Patents Abstracts of Japan, vol. 6, No. 245 (P-159) [1123], 3rd Dec. 1982; & JP-n A-57 141 641 (Fujitsu K.K.) 02-09-1982.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pattern-forming material and its production and use does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pattern-forming material and its production and use, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pattern-forming material and its production and use will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-243030

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.