Pattern formation process for an integrated circuit substrate

Details Pattern formation process for an integrated circuit substrate Pattern formation process for an integrated circuit substrate

2005-04-19

2005-04-19

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C438S108000, C438S622000, C438S625000, C438S666000, C438S667000, C438S623000

Reexamination Certificate

active

06881662

ABSTRACT:
A pattern formation process for an integrated circuit substrate, which is not employing the conventional method of filling resin material directly in via filling process but adapting the metal spray method, the metal vapor deposition method or any combination thereof to form the pattern including circuits and pads and stuff the vias and the through holes.

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patent: 20030203705 (2003-10-01), Leng

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