Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-10-23
1987-09-01
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29610R, 29620, 156646, 156653, 156657, 1566591, 156662, 20419232, 338308, 427103, H01L 21306, B44C 122, C23F 102, C03C 1500
Patent
active
046907289
ABSTRACT:
A process for delineating a vertical resistor on a semiconductor device is disclosed. Resistive and diffusion barrier layers are deposited and then etched, first by dry plasma and then by wet bath. The two step etching allows complete removal of the deposited layers with minimal damage to exposed dielectric, silicide, polysilicon or doped regions on the semiconductor.
REFERENCES:
patent: 3900944 (1975-08-01), Fuller et al.
patent: 4208781 (1980-06-01), Rao et al.
patent: 4341594 (1982-07-01), Carlson et al.
patent: 4445966 (1984-05-01), Carlson et al.
Ghandhi, "VLSI Fabrication Principles", A Wiley-Interscience Publication 1983, pp. 427-429.
Adams, "VLSI Technology", 1983, McGraw Hill, pp. 120-123.
Kawamoto Galen
Tsang Chi-Hwa
Yau Leopoldo D.
Intel Corporation
Powell William A.
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