Paste including a mixture of powders, connection plug,...

Details Paste including a mixture of powders, connection plug,... Paste including a mixture of powders, connection plug,...

2006-05-23

2006-05-23

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S640000, C438S675000, C438S977000

Reexamination Certificate

active

07049223

ABSTRACT:
Form a trench in a major surface of a semiconductor substrate, then bury a paste in the trench. The paste contains solids having a conductive substance and a resin, and solvent for dissolving the resin. The solids content of the paste is not less than 60 vol % and a viscosity ratio thereof is not more than 2.

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Japanese Office Action dated Jul. 10, 2003, and English translation thereof.
Japanese Patent Office Action dated Nov. 4, 2003, and English translation thereof.

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