Optical waveguides – With optical coupler – With alignment device
Reexamination Certificate
2006-06-27
2006-06-27
Palmer, Phan (Department: 2874)
Optical waveguides
With optical coupler
With alignment device
C385S088000
Reexamination Certificate
active
07068892
ABSTRACT:
An optical-electrical interface includes an alignment interface and an optoelectronic die. The alignment interface is mounted to a substrate and includes a waveguide port to receive an external waveguide from a first side. The alignment interface includes a conductor disposed on a second side of the alignment interface to couple to a conductor on the substrate. The optoelectronic die is mounted to the second side of the alignment interface. The optoelectronic die includes an electrical port coupled to the conductor disposed on the alignment interface, an optoelectronic device coupled to the electrical port and an optical port aligned to optically couple the optoelectronic device to the external waveguide through the alignment interface.
REFERENCES:
patent: 4943136 (1990-07-01), Popoff
patent: 4944568 (1990-07-01), Danbach et al.
patent: 5359686 (1994-10-01), Galloway et al.
patent: 6834133 (2004-12-01), Towle et al.
patent: 2004/0126058 (2004-07-01), Lu et al.
patent: 2004/0126064 (2004-07-01), Vandentop et al.
patent: 2004/0190831 (2004-09-01), Lu et al.
patent: 2005/0036728 (2005-02-01), Braunisch
Mohammed, E. M. et al., “Optical I/O technology for digital VLSI,” Proceedings of SPIE, vol. 5358, (2004), pp. 60-70.
Towle, S. et al., “Methods and Apparatus to Optically Couple an Optoelectronic Chip to a Waveguide,” U.S. Appl. No. 10/664,475, filed Sep. 17, 2003.
Braunisch, H. et al., “Waveguide Coupling Mechanism,” U.S. Appl. No. 10/934,858, filed Sep. 3, 2004.
Lu, D. et al., “Optical Package,” U.S. Appl. No. 10/954,903, filed Sep. 30, 2004.
Towle, S. et al., “On-Substrate Microlens to Couple an Off-Substrate Light Emitter and/or Receiver with an On-Substrate Optical Device,” U.S. Appl. No. 10/955,553, filed Sep. 30, 2004.
Towle, S. et al., “Manufacturable Connectorization Process for Optical Chip-to-Chip Interconnects,” U.S. Appl. No. 10/955,897, filed Sep. 30, 2004.
Mohammed, E., “Surface Mount (SMT) Connector for VCSEL and Photodiode Arrays,” U.S. Appl. No. 10/971,234, filed Oct. 22, 2004.
U.S. Appl. No. 11/124,033, filed May 6, 2005.
Braunisch Henning
Lu Daoqiang
Mohammed Edris M.
Young Ian
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Palmer Phan
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