Passive components in the back end of integrated circuits

Details Passive components in the back end of integrated circuits Passive components in the back end of integrated circuits

2010-08-03

2011-10-18

Sandvik, Benjamin (Department: 2826)

Semiconductor device manufacturing: process

Making passive device

Planar capacitor

C257SE21019

Reexamination Certificate

active

08039354

ABSTRACT:
Passive components are formed in the back end by using the same deposition process and materials as in the rest of the back end. Resistors are formed by connecting in series individual structures on the nth, (n+1)th, etc levels of the back end. Capacitors are formed by constructing a set of vertical capacitor plates from a plurality of levels in the back end, the plates being formed by connecting electrodes on two or more levels of the back end by vertical connection members.

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