Passivation scheme for bumped wafers

Details Passivation scheme for bumped wafers Passivation scheme for bumped wafers

2006-03-07

2006-03-07

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S614000, C438S618000, C438S683000

Reexamination Certificate

active

07008868

ABSTRACT:
A bumped wafer for use in making a chip device. The bumped wafer includes two titanium layers sputtered alternatingly with two copper layers over a non-passivated die. The bumped wafer further includes under bump material under solder bumps contained thereon.

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