Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-03-06
2007-03-06
Lindsay, Jr., Walter L. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S622000, C438S637000
Reexamination Certificate
active
10931355
ABSTRACT:
A method for passivating a substrate, such as a semiconductor substrate, that is to be “metallized,” or on which a metal film or structure is to be formed, includes exposing regions of the substrate that are to be metallized to hydrogen radicals or nitrogen radicals. The regions of the substrate that are treated in this fashion are coated or “stuffed.” Passivation of this type may be effected with a plasma that includes a gas such as argon, nitrogen, helium, or hydrogen, or a mixture of any of the foregoing, which will remove oxygen molecules from the surface to which metal adhesion is desired. The metal may then be formed thereon. Hydrogen radicals may also be used to passivate the surface of a substrate, such as a semiconductor substrate, from spontaneous fluorine etching. Such passivation is, of course, effected in a substantially fluorine free environment.
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Lindsay Jr. Walter L.
Micro)n Technology, Inc.
TraskBritt
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