Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-10-06
1988-01-12
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 156646, 118 501, 118620, 118729, 427 38, 2041921, 20419232, 204298, H01L 21306, B44C 122, C23C 1400, B05D 306
Patent
active
047189754
ABSTRACT:
A vacuum processing system for processing semiconductor wafers includes a particle shield (16) disposed above the wafer (10) to block moving particles in a vacuum chamber which would otherwise contact the wafer (10). The particle shield (16) is attached to arm (18), allowing the particle shield (16) to be moved away from the wafer or photomask during processing.
REFERENCES:
patent: 3984301 (1976-10-01), Matsuzaki et al.
patent: 4584045 (1986-04-01), Richards
Bowling Robert A.
Larrabee Graydon B.
Liu Benjamin Y. H.
Heiting Leo N.
Merrett N. Rhys
Powell William A.
Sharp Melvin
Texas Instruments Incorporated
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