Parallel testing of semiconductor devices using a dividing...

Details Parallel testing of semiconductor devices using a dividing... Parallel testing of semiconductor devices using a dividing...

2008-08-04

2009-12-01

Nguyen, Vinh P (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07626413

ABSTRACT:
Provided is a method of performing a parallel test on semiconductor devices, the method including coupling a power signal line to a set of at least two semiconductor devices through a switching device, performing at least one part of a parallel test on the set of semiconductor devices, and disconnecting a semiconductor device from the set in response to determining that the semiconductor device is defective as a result of the at least one part of the parallel test.

REFERENCES:
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5130645 (1992-07-01), Levy
patent: 5146161 (1992-09-01), Kiser
patent: 5736850 (1998-04-01), Legal
patent: 5973504 (1999-10-01), Chong
patent: 6204679 (2001-03-01), Gray, III
patent: 6452411 (2002-09-01), Miller et al.
patent: 6480978 (2002-11-01), Roy et al.
patent: 6499121 (2002-12-01), Roy et al.
patent: 6657455 (2003-12-01), Eldridge et al.
patent: 7227351 (2007-06-01), Kim et al.
patent: 2003/0115519 (2003-06-01), Kwon et al.
patent: 2006/0015785 (2006-01-01), Chun
patent: 2008/0091979 (2008-04-01), Okuda
patent: 10-221402 (1998-08-01), None
patent: 1997-0016609 (1997-04-01), None
patent: 1998-028731 (1998-07-01), None
patent: 2000-0041167 (2000-07-01), None
English language abstract of Korean Publication No. 1997-0016609.
English language abstract of Korean Publication No. 1998-028731.
English language abstract of Korean Publication No. 2000-0041167.
English language abstract of Japanese Publication No. 10-221402.

Affiliated with

Also associated with

Rating

Parallel testing of semiconductor devices using a dividing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Parallel testing of semiconductor devices using a dividing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Parallel testing of semiconductor devices using a dividing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4062649