Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-10-09
2007-10-09
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S624000, C029S829000
Reexamination Certificate
active
10717977
ABSTRACT:
Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.
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Kim Tae-Hoon
Mok Jee-Soo
Song Chang-Kyu
Sun Byung-Kook
Yun Geum-Hee
Christensen O'Connor Johnson & Kindness PLLC
Samsung Electro-Mechanics Co. Ltd.
Trinh Michael
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