Parallel manufacturing of semiconductor devices and the resultin

Details Parallel manufacturing of semiconductor devices and the resultin Parallel manufacturing of semiconductor devices and the resultin

1994-01-27

1996-05-07

Thomas, Tom

Fishing, trapping, and vermin destroying

437180, 437195, 437209, H01L 21768

Patent

active

055146139

ABSTRACT:
In accordance with this invention, integrated circuits are manufactured using parallel processing to manufacture separately selected parts of finished integrated circuits. Upon completion of the parts, the parts are joined together to form the completed integrated circuit. For example, a semiconductor wafer containing active and passive semiconductor regions is fabricated through the first layer of insulation and first conductive contacts. Separately, an interconnect structure is fabricated on a separate fabrication line to include all the layers of interconnects required to form a completed integrated circuit when joined to the wafer. The interconnect structure is joined to the wafer to form the complete integrated device. The interconnect structure can be fabricated to exclude from the integrated circuit those portions of the wafer which have been determined by test to be defective.

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patent: 4067104 (1978-01-01), Tracy
patent: 4295149 (1981-10-01), Balyoz et al.
patent: 4709468 (1987-12-01), Wilson
patent: 4778771 (1988-10-01), Hilci
patent: 5192716 (1993-03-01), Jacobs

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