Parallel alignment method and apparatus for chemical...

Details Parallel alignment method and apparatus for chemical... Parallel alignment method and apparatus for chemical...

2005-08-30

2005-08-30

Nguyen, Dung Van (Department: 3723)

Abrading

Machine

Rotary tool

C451S401000

Reexamination Certificate

active

06935934

ABSTRACT:
A chemical mechanical polishing apparatus is provided. The apparatus includes a single polishing pad and a leaf structure having a pair of fingers. Each finger holds a carrier device designed to hold a wafer to be polished. The leaf structure is configured to apply each of the wafers onto the single polishing pad.

REFERENCES:
patent: 5681215 (1997-10-01), Sherwood et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 6045716 (2000-04-01), Walsh et al.
patent: 6354926 (2002-03-01), Walsh

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