Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1990-05-14
1991-09-17
Heinrich, Sam
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
2281802, 228215, 228220, 22826312, 357 71, 437209, H05K 334, B23K10140
Patent
active
050487442
ABSTRACT:
The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.
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Chang Chin-An
Koopman Nicholas G.
Roldan Judith M.
Srivastava Kamalesh K.
Strickman Steven
Heinrich Sam
International Business Machines - Corporation
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