Paired pivot arm

Details Paired pivot arm Paired pivot arm

2007-09-25

2007-09-25

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S041000

Reexamination Certificate

active

11438497

ABSTRACT:
The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polishing head direct access to two polishing stations. The polishing system of the present invention provides flexibility and improves throughput.

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