Padless high density circuit board

Details Padless high density circuit board Padless high density circuit board

2005-03-08

2005-03-08

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S738000, C257S734000, C257S693000, C257S778000, C257S775000, C257S773000

Reexamination Certificate

active

06864586

ABSTRACT:
A padless high density circuit board and manufacturing method thereof. The method includes providing a circuit board substrate, forming external wiring, having a plurality of external terminals with a width as large as or less than the external wiring on the circuit board substrate, forming a solder mask over the circuit board substrate and the external wiring with a plurality of solder mask openings exposing the external terminals, with diameters at least as large as the widths of the external terminals exposed thereby, and forming a plurality of conductive bumps on the external terminals exposed by the solder mask openings for connection with an external device in a subsequent assembly process.

REFERENCES:
patent: 5316799 (1994-05-01), Brunken et al.
patent: 5766492 (1998-06-01), Sadahisa et al.
patent: 6443351 (2002-09-01), Huang et al.
patent: 6444561 (2002-09-01), Wang et al.
patent: 6506978 (2003-01-01), Furihata
patent: 6543128 (2003-04-01), Huang et al.
patent: 6586682 (2003-07-01), Strandberg

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