Pad printing of resist over via holes

Details Pad printing of resist over via holes Pad printing of resist over via holes

1990-09-24

1991-11-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156634, 156656, 1566591, 156902, B44C 122, C23F 102

Patent

active

050663607

ABSTRACT:
Transfer printing from pad (9) is made in a pattern of resist (15) which covers a via (3) on a circuit board (1) metalized with a continuous copper layer (7). After transfer of resist material (14) to the pad, the pattern on the pad is hardened enough to be self-supporting by applying moderate radiation or allowing solvent to escape from the resist on the pad. The resist is transferred from the pad to the circuit board (1) and is then fully hardened, and the circuit board is immersed in etchant to remove unprotected copper (7). Copper in the covered vias is protected and therefore separate metalizations of vias is avoided. Since pad printing is particularly useful in general with three dimensional circuit boards, the use of pad printing to avoid separate metalization of vias is economic since it involves little additional to the general use.

REFERENCES:
patent: 3701317 (1972-10-01), Miyamoto et al.
patent: 4127436 (1978-11-01), Friel
patent: 4327167 (1982-04-01), Tanabe
patent: 4522671 (1985-06-01), Gunwald et al.
patent: 4911786 (1990-03-01), Kindl et al.
patent: 4964947 (1990-10-01), Yarita et al.

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