Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2006-06-21
2008-11-04
Kik, Phallaka (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C439S068000
Reexamination Certificate
active
07448016
ABSTRACT:
A pad layout of a printed circuit board includes a first and a second pad symmetrically arranged on the PCB for cooperatively receiving either a first surface mounted component (SMC) or a second surface mounted component (SMC). Each of the SMCs includes a first footprint and a second footprint. The first pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the first footprint of the first SMC and a shape of the first footprint of the second SMC. The second pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the second footprint of the first SMC and a shape of the second footprint of the second SMC.
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Huang Ya-Ling
Tai Chan-Fei
Hon Hai Precision Industry Co. Ltd.
Hong Fu Jin Precision Industry ( Shenzhen) Co., Ltd.
Kik Phallaka
Morris, Martin & Martin LLP
Tingkang Xia, Esq. Tim
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