Electrical computers and digital processing systems: memory – Storage accessing and control – Memory configuring
Patent
1997-04-04
1999-05-04
Swann, Tod R.
Electrical computers and digital processing systems: memory
Storage accessing and control
Memory configuring
36518902, 36523002, G06F 1200, G11C 700
Patent
active
059000210
ABSTRACT:
A configurable input device for an integrated circuit having a plurality of input pads, the input device including a plurality of buffers, where each buffer is associated with one of the input pads. Each buffer receives a mode select signal and the buffer is responsive to the mode select signal to place the buffer in an enabled mode or a disabled mode. A receiver portion within each buffer is coupled to the associated input pad. The receiver portion pulls the associated input pad to a preselected logic state while the buffer is in the disabled mode. An output driver within each buffer generates an output signal responsive to a signal on the associated input pad while the buffer is in the enable mode and provides a high impedance while the buffer is in the disabled mode. An output node is coupled to the output drivers of the plurality of buffers.
REFERENCES:
patent: 4551634 (1985-11-01), Takahashi et al.
patent: 4825099 (1989-04-01), Barton
patent: 5373470 (1994-12-01), Jones, Jr.
patent: 5406525 (1995-04-01), Nicholes
patent: 5572718 (1996-11-01), Scriber et al.
patent: 5600271 (1997-02-01), Erickson et al.
patent: 5706235 (1998-01-01), Roohparvar et al.
patent: 5757704 (1998-05-01), Hachiya
Faue Jon Allan
Tiede John William
Bachand Richard A.
Langley Stuart T.
Nippon Steel Semiconductor Corporation
Swann Tod R.
Thai Tuan V.
LandOfFree
Pad input select circuit for use with bond options does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Pad input select circuit for use with bond options, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pad input select circuit for use with bond options will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1867399