Pad conditioning head for CMP process

Details Pad conditioning head for CMP process Pad conditioning head for CMP process

2007-10-29

2008-12-02

MacArthur, Sylvia R. (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C451S444000, C451S445000, C451S056000

Reexamination Certificate

active

07459056

ABSTRACT:
In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between the rotatable member and the end effector. The elastic device is (a) adapted to rotate the end effector via a torque from the rotatable member, and (b) flexibly extensible so as to impart a force to the end effector while permitting the end effector to deviate from a perpendicular alignment with the rotatable member in order for a conditioning surface of the conditioning disk to conform to an irregular polishing surface of a pad being conditioned. Numerous other aspects are provided, including methods and apparatus for using liquid or gas to deter polishing slurry or debris from entering the conditioning head.

REFERENCES:
patent: 7288165 (2007-10-01), Polyak et al.
patent: 2008/0057836 (2008-03-01), Polyak et al.

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