Pad conditioning head for CMP process

Details Pad conditioning head for CMP process Pad conditioning head for CMP process

2007-10-30

2007-10-30

MacArthur, Sylvia R. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C451S443000, C451S444000, C451S072000, C451S066000

Reexamination Certificate

active

10970365

ABSTRACT:
In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between the rotatable member and the end effector. The elastic device is (a) adapted to rotate the end effector via a torque from the rotatable member, and (b) flexibly extensible so as to impart a force to the end effector while permitting the end effector to deviate from a perpendicular alignment with the rotatable member in order for a conditioning surface of the conditioning disk to conform to an irregular polishing surface of a pad being conditioned. Numerous other aspects are provided, including methods and apparatus for using liquid or gas to deter polishing slurry or debris from entering the conditioning head.

REFERENCES:
patent: 5885147 (1999-03-01), Kreager et al.
patent: 5913714 (1999-06-01), Volodarsky et al.
patent: 6042457 (2000-03-01), Wilson et al.
patent: 6358124 (2002-03-01), Koga et al.
patent: 6899604 (2005-05-01), Togawa et al.
patent: 2003/0148707 (2003-08-01), Togawa et al.
patent: 2003/0166383 (2003-09-01), Kimura et al.
patent: 2005/0167048 (2005-08-01), Polyak et al.

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