Pad conditioner for chemical mechanical polishing apparatus

Details Pad conditioner for chemical mechanical polishing apparatus Pad conditioner for chemical mechanical polishing apparatus

2007-08-28

2007-08-28

Morgan, Eileen P. (Department: 3723)

Abrading

Machine

Rotary tool

C451S443000, C451S529000

Reexamination Certificate

active

11368704

ABSTRACT:
A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the edge portion of the surface and the relatively irregular shaped and friable polishing particles may be provided on the center portion of the surface.

REFERENCES:
patent: 2309016 (1943-01-01), Ryan
patent: 5389032 (1995-02-01), Beardsley
patent: 5503592 (1996-04-01), Neumann
patent: 5951380 (1999-09-01), Kim
patent: 6179695 (2001-01-01), Takahashi et al.
patent: 6248006 (2001-06-01), Mukhopadhyay et al.
patent: 6309282 (2001-10-01), Wright et al.
patent: 6386956 (2002-05-01), Sato et al.
patent: 6419574 (2002-07-01), Takahashi et al.
patent: 6659846 (2003-12-01), Misra et al.
patent: 6905398 (2005-06-01), Jeong
patent: 7004823 (2006-02-01), Kisboll et al.
patent: 7052371 (2006-05-01), Benner
patent: 2004/0137834 (2004-07-01), Webb et al.
patent: 2006/0089095 (2006-04-01), Swisher et al.
patent: 2002-337050 (2002-11-01), None
patent: 2004-130475 (2004-04-01), None
patent: 1999-0081117 (1999-11-01), None

Affiliated with

Also associated with

Rating

Pad conditioner for chemical mechanical polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pad conditioner for chemical mechanical polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pad conditioner for chemical mechanical polishing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3858132