Pad conditioner control using feedback from a measured...

Details Pad conditioner control using feedback from a measured... Pad conditioner control using feedback from a measured...

2006-03-28

2006-03-28

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S041000, C451S056000, C451S444000

Reexamination Certificate

active

07018269

ABSTRACT:
The present invention is a system for controlling a pad conditioner in a CMP device. The system includes a roughness-sensing device mounted in proximity to a polishing pad. The roughness-sensing device generates an output responsive to a roughness of the polishing pad. A signal-processing unit then generates a roughness value of the polishing pad in response to the output from the roughness-sensing device, and generates a control signal in response to the generated roughness value. Finally, a control device controls motion of the pad conditioner in response to the control signal.

REFERENCES:
patent: 5961373 (1999-10-01), Lai et al.
patent: 5985093 (1999-11-01), Chen
patent: 6419553 (2002-07-01), Koinkar et al.
patent: 2003/0136055 (2003-07-01), Li et al.
patent: 2004/0038534 (2004-02-01), Taylor
patent: 2004/0162006 (2004-08-01), Hua et al.

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