Packaging structure of BGA type semiconductor device mounted on

Details Packaging structure of BGA type semiconductor device mounted on Packaging structure of BGA type semiconductor device mounted on

1998-06-24

2000-02-01

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257737, 257778, 257787, H01L 2348

Patent

active

060206381

ABSTRACT:
A packaging structure of a semiconductor device having a BGA type package structure. The packaging structure has a circuit substrate for mounting a semiconductor device having a BGA type package structure thereon, a semiconductor device having the BGA type package structure in which BGA balls that are external terminals are electrically connected to the circuit substrate, and insulating resin charged between the circuit substrate and the semiconductor device.

REFERENCES:
patent: 5726502 (1998-03-01), Beddingfield
patent: 5801447 (1998-09-01), Hirano et al.

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