Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2008-03-25
2008-03-25
Nguyen, Ha Tran (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S760020
Reexamination Certificate
active
11491216
ABSTRACT:
A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.
REFERENCES:
patent: 3983479 (1976-09-01), Lee et al.
patent: 4481403 (1984-11-01), Del Monte
patent: 4922377 (1990-05-01), Matsumoto et al.
patent: 5361032 (1994-11-01), Waterbly
patent: 5489851 (1996-02-01), Heumann et al.
patent: 5500603 (1996-03-01), Le
patent: 5539186 (1996-07-01), Abrami et al.
patent: 5936260 (1999-08-01), Corbett et al.
patent: 6064219 (2000-05-01), Aigner
patent: 6538264 (2003-03-01), Corbett et al.
patent: 6577149 (2003-06-01), Doong et al.
patent: 6933730 (2005-08-01), Parker et al.
patent: 2002/0024046 (2002-02-01), Corbett et al.
patent: 2003/0151047 (2003-08-01), Corbett et al.
Blanchet Jason E.
Crain, Jr. James V.
Griffin Charles W.
Stone David B.
White Robert F.
Jordan John A.
Nguyen Ha Tran
Steinberg William H.
Velez Roberto
LandOfFree
Packaging reliability super chips does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging reliability super chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging reliability super chips will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3917030