4. Geometrical instruments

Robert F. White

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Electrical plug ejecting apparatus

Geometrical instruments
Patent

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Engine mount

Supports – Pipe or cable – Extending through plate
Patent

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Extension of fatigue life for C4 solder ball to chip connection

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Extension of fatigue life for C4 solder ball to chip connection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Packaging reliability super chips

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1854461

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