Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2008-07-29
2008-07-29
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S106000, C438S113000, C438S114000, C438S116000, C257SE21001
Reexamination Certificate
active
07405100
ABSTRACT:
Packages of semiconductor devices with non-opaque covers and methods for making the packages. The invention allows an encapsulant to be used with a non-opaque cover. By ensuring the cover is attached to a die in such a way as to expose bonding pads while sealing in the imaging portion of the die, the die can be electrically connected to a substrate and then encapsulated. Since the imaging portion is sealed, the encapsulant cannot get underneath the glass. By ensuring the encapsulant is not filled beyond the glass, encapsulant cannot get over the glass either.
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Mostafazadeh Shahram
Smith Joseph O.
Beyer Law Group LLP
Geyer Scott B.
National Semiconductor Corporation
Roman Angel
LandOfFree
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