Packaging method of a light-sensing semiconductor device and...

Details Packaging method of a light-sensing semiconductor device and... Packaging method of a light-sensing semiconductor device and...

2008-04-07

2009-06-16

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C257SE21499, C257SE31110

Reexamination Certificate

active

07547571

ABSTRACT:
The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

REFERENCES:
patent: 6057597 (2000-05-01), Farnworth et al.
patent: 6777767 (2004-08-01), Badehi
patent: 7378724 (2008-05-01), Yu et al.

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