Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-05-05
1998-07-14
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 257739, H05K 334
Patent
active
057785260
ABSTRACT:
A package for electrical components in which a circuit board holds the components, includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space and are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal spaces. In other aspects, a resilient non-compressive encapsulant is used to fill a space within the package; an electronic component is mounted with a power-dissipating device sitting in the aperture of a circuit board, a power-dissipating surface in contact with a baseplate, and contact pads electrically connected to a circuit board; terminal pins are connected to a circuit board using a fence connected at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the fence comprising at least two conductive links joined by a severable junction.
REFERENCES:
patent: 3621338 (1971-11-01), Rogers et al.
patent: 3683241 (1972-08-01), Duncan
patent: 3737729 (1973-06-01), Carney
patent: 3766440 (1973-10-01), Baird
patent: 3769702 (1973-11-01), Scarbrough
patent: 3900770 (1975-08-01), Kaufman
patent: 4156148 (1979-05-01), Kaufman
patent: 4196411 (1980-04-01), Kaufman
patent: 4215235 (1980-07-01), Kaufman
patent: 4218724 (1980-08-01), Kaufman
patent: 4218725 (1980-08-01), Heffner et al.
patent: 4250481 (1981-02-01), Kaufman
patent: 4257091 (1981-03-01), Kaufman
patent: 4266140 (1981-05-01), Kaufman
patent: 4394530 (1983-07-01), Kaufman
patent: 4400762 (1983-08-01), Bartley et al.
patent: 4417296 (1983-11-01), Schelhorn
patent: 4449165 (1984-05-01), Kaufman
patent: 4449292 (1984-05-01), Kaufman
patent: 4488202 (1984-12-01), Kaufman
patent: 4498120 (1985-02-01), Kaufman
patent: 4531145 (1985-07-01), Wiech, Jr.
patent: 4546410 (1985-10-01), Kaufman
patent: 4546411 (1985-10-01), Kaufman
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4554613 (1985-11-01), Kaufman
patent: 4574162 (1986-03-01), Kaufman
patent: 4577387 (1986-03-01), Kaufman
patent: 4691265 (1987-09-01), Calver et al.
patent: 4724283 (1988-02-01), Shimada et al.
patent: 4724514 (1988-02-01), Kaufman
patent: 4736520 (1988-04-01), Morris
patent: 4740414 (1988-04-01), Shaheen
patent: 4750089 (1988-06-01), Derryberry et al.
patent: 4750092 (1988-06-01), Werther
patent: 4769525 (1988-09-01), Leatham
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4783697 (1988-11-01), Benenati et al.
patent: 4840286 (1989-06-01), Heberling et al.
patent: 4847136 (1989-07-01), Lo
patent: 4872081 (1989-10-01), Murphy et al.
patent: 4879630 (1989-11-01), Boucard et al.
patent: 4889257 (1989-12-01), Yammaoto
patent: 4899257 (1990-02-01), Yamamoto
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 4953005 (1990-08-01), Carlson et al.
patent: 4994215 (1991-02-01), Wiech, Jr.
patent: 5001603 (1991-03-01), Villaneuva, III et al.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5019941 (1991-05-01), Craft
patent: 5019946 (1991-05-01), Eichelberger et al.
patent: 5028987 (1991-07-01), Neuebauer et al.
patent: 5111362 (1992-05-01), Flamm et al.
patent: 5206986 (1993-05-01), Arai et al.
patent: 5258888 (1993-11-01), Korinsky
patent: 5375322 (1994-12-01), Leeb
Gates and Yokoro; "Sealed Chip-On-Board Circuit Protection"; 3rd International Sampe Electronics Conference; Jun. 20-22, 1989; pp. 929-938.
Balog John S.
Finnemore Fred
Johnson Brant T.
Vinciarelli Patrizio
Arbes Carl J.
VLT Corporation
LandOfFree
Packaging electrical components does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging electrical components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging electrical components will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1870949